|
HS Code |
317801 |
| Chemical Formula | C8H6N2S2 |
| Molecular Weight | 194.28 |
| Appearance | Solid (usually) |
| Odor | Characteristic sulfur - like (due to thiol group) |
| Solubility In Water | Low (due to non - polar nature of the molecule) |
| Solubility In Organic Solvents | Soluble in some polar organic solvents like DMSO, DMF |
| Pka Of Thiol Group | Around 9 - 10 (approximate value for thiol in this context) |
| Color | Typically off - white to light - colored solid |
As an accredited 4-(4-Pyridinyl)Thiazole-2-Thiol;2-Mercapto-4-(Pyridine-4-Yl) Tniazole factory, we enforce strict quality protocols—every batch undergoes rigorous testing to ensure consistent efficacy and safety standards.
| Packing | 100g of 4-(4 - Pyridinyl)Thiazole - 2 - Thiol in sealed, chemical - resistant packaging. |
| Shipping | The chemical "4-(4 - Pyridinyl)Thiazole - 2 - Thiol; 2 - Mercapto - 4 - (Pyridine - 4 - Yl) Tniazole" will be shipped in sealed, corrosion - resistant containers, following strict hazardous material shipping regulations to ensure safety during transit. |
| Storage | 4-(4 - Pyridinyl)Thiazole - 2 - Thiol; 2 - Mercapto - 4 - (Pyridine - 4 - Yl) Thiazole should be stored in a cool, dry place away from heat sources and ignition sources. Keep it in a tightly sealed container to prevent exposure to air and moisture, which could potentially cause degradation or reaction. Store separately from incompatible substances, such as strong oxidizing agents. |
```htmlThe interfacial adhesion between sulfur-cured natural rubber (NR)/butadiene rubber (BR) blends and brass-coated steel cord in radial tire belt skim compounds is governed by the in-situ formation of a non-stoichiometric copper sulfide (CuxS) film during vulcanization. In formulations where the cobalt salt loading is reduced from 0.45 phr to 0.12 phr to meet REACH Annex XVII cobalt restriction targets, the introduction of 0.8–1.5 phr 4-(4-pyridinyl)thiazole-2-thiol restores the critical sulfidation rate required to achieve ≥ 450 N pull-out force per cord after 93 % relative humidity aging for 14 days at 70 °C, as measured per ASTM D2229-19a. The compound is added during the masterbatch stage in an intermeshing tangential rotor internal mixer with a fill factor of 0.72 and a drop temperature of 145 °C, ensuring the thiol functionality does not initiate premature crosslinking with the sulfenamide accelerator package. Moving die rheometer (MDR) data at 160 °C, 0.5° arc show a scorch time ts2 reduction of 0.4 min relative to a cobalt-only system and a delta torque increase of 2.1 dN·m, indicating higher crosslink density at the rubber–brass interface. The manufacturing process involves a quadruple-roll calendar producing a 0.9 mm skim gauge on 3+9×0.22 brass cord at 60 m/min, followed by building and steam-heated press curing under 22 bar platen pressure. The terminal product is a 205/55 R16 passenger car radial tire belt layer, for which OEM specifications require a 100 % rubber coverage rating on the cord surface after destructive peel testing.How Does This Heterocyclic Thiol Function as a Leveler in High-Throw Acid Copper Electrolytes?When electrodeposited copper must fill blind microvias with aspect ratios exceeding 1:1 in 2.2 mm thick HDI printed circuit boards, the suppression of deposition on surface peaks and the promotion of bottom-up fill becomes critical. In a vertical continuous plating (VCP) line operating at 2.0 A/dm² cathode current density with a 65 g/L CuSO4·5H2O, 190 g/L H2SO4, and 60 mg/L chloride ion base electrolyte, the addition of 25–80 mg/L 2-mercapto-4-(pyridin-4-yl)thiazole introduces a strong cathodic polarization of 120–160 mV at 1 A/dm² as measured by galvanostatic chronopotentiometry. The pyridine nitrogen, being partially protonated at the operating pH < 1, adsorbs preferentially onto high-charge-density zones of the copper surface while the thiolate form anchors to Cu atoms, creating a transient barrier film that is displaced more slowly in recessed areas due to mass-transport limitation of the leveler species. Hull cell panels (267 mL, 2 A, 10 min, vigorous air agitation) exhibit a fully bright, ductile deposit range extending from 0.15 A/dm² to the high-current-density edge, whereas a blank electrolyte yields semi-bright deposit above 2.5 A/dm² and burned powder at the edge. Compliance with IPC-6012E Class 3 requirements for plated-through hole reliability is demonstrated by thermal shock testing at 288 °C for 10 s (solder float) showing no corner cracking or separation in cross-sectioned microvias after 6 cycles. The downstream production step connects the VCP line with inline reverse-pulse rinsing and an anti-tarnish benzotriazole post-dip. The finished product is a high-layer-count multilayer PCB sub-component used in automotive ADAS radar modules and 5G base station antenna arrays.Concentration-Dependent Passivation of Copper in Recirculating Acid Descale SolutionsIn closed-loop chemical cleaning of shell-and-tube heat exchangers fabricated from CuNi 90/10 alloy (UNS C70600), mineral acid descaling solutions containing sulfamic acid (8–12 wt%) and citric acid (3 wt%) are circulated at linear velocities of 1.5–2.2 m/s and temperatures of 45–55 °C to remove calcium carbonate scale. The addition of 0.08–0.25 wt% 4-(4-pyridinyl)thiazole-2-thiol produces a chemisorbed monolayer on the alloy surface, confirmed by XPS analysis showing a pronounced Cu 2p3/2 binding energy shift to 932.4 eV indicative of Cu–S coordination and a suppression of the Cu(OH)2 shake-up satellite. Weight-loss immersion tests according to ASTM G31-21 over a 6-hour exposure period reduce the general corrosion rate from 12.4 mm/year in uninhibited 10 % sulfamic acid to 0.034 mm/year at the optimal concentration of 0.18 wt%, corresponding to an inhibition efficiency of 99.7 %. Potentiodynamic polarization scans at a scan rate of 0.5 mV/s reveal that the inhibitor shifts the corrosion potential Ecorr by +45 mV and suppresses the anodic Tafel slope by predominantly blocking copper dissolution while leaving the cathodic hydrogen evolution reaction unaffected. Above 0.30 wt%, localized desorption occurs at elevated turbulence zones near tube inlet ends, causing a sharp increase in pitting frequency visible in scanning electron micrographs. The industrial cleaning operation uses a skid-mounted positive displacement pump delivering 380 L/min with a holding tank of 2,000 L, and the spent solution is neutralized to pH 7.5 before discharge. The formulated descaling concentrate is sold as a ready-to-dilute blend to service companies maintaining district cooling plants and petrochemical feedwater pre-heaters.Synthetic routes to pyridylmethylsulfinyl benzimidazole-based proton pump inhibitor candidates frequently require a thiol-containing heterocycle to construct the thioether linkage prior to oxidation to the sulfoxide. In a typical batch process, 1.0 mole equivalent of 2-mercapto-4-(pyridin-4-yl)thiazole is dissolved in anhydrous tetrahydrofuran (5 volumes) containing powdered potassium carbonate (1.2 eq) and a phase-transfer catalyst (tetrabutylammonium bromide, 0.05 eq). A solution of 1.08 eq 2-chloromethyl-5-methoxy-1H-benzimidazole hydrochloride in dimethylformamide is added dropwise over 45 min at 20–25 °C under nitrogen, and the mixture is stirred for an additional 4 hr at 35 °C. HPLC monitoring (C18 column, acetonitrile/0.1% phosphoric acid gradient) indicates ≥ 98.5 % conversion to the thioether intermediate with < 0.3 % disulfide byproduct when the molar ratio of the alkylating agent is carefully controlled. Compliance with ICH Q7 Good Manufacturing Practice for active pharmaceutical ingredient starting materials mandates residual solvent analysis by headspace GC-FID meeting USP <467> limits, absence of elemental impurities per USP <232>/<233> (Class 1 metals below 30 µg/g), and a water content determined by Karl Fischer titration of < 0.5 %. The isolated intermediate is filtered, washed with deionized water, dried under vacuum at 40 °C for 12 hr, and packed in double LDPE-lined fiber drums under argon atmosphere. The end product serves as a regulated starting material for Phase II clinical trial API manufacturing, with the thiol functionality subsequently oxidized to a sulfoxide by 1.05 eq m-chloroperbenzoic acid at −20 °C in dichloromethane.Pre-Dip Accelerator Formulations for Electroless Copper on FR-4 SubstratesFollowing palladium activation in a chlorostannous colloidal seeding bath, glass-epoxy laminates are immersed in a pre-dip accelerator solution containing 50–150 mg/L of the subject compound at 40 °C and pH 11.8 for 3–4 min prior to electroless copper deposition from a formaldehyde-reduced bath. The accelerator displaces residual stannous hydroxide complexes from the Pd seed nuclei and forms a mixed-ligand Pd–thiolate–pyridine coordination structure that lowers the activation energy for the anodic oxidation of formaldehyde, as indicated by a 65 mV negative shift in the mixed potential measured against an Ag/AgCl reference. Bath analytical control is maintained by UV-Vis absorbance at 312 nm, with replenishment additions of 0.02 g per 200 amp-hours of production throughput to compensate for drag-out. Production-scale horizontal conveyorized lines operate at a dwell time of 8 min in the subsequent electroless copper bath at 38 °C, depositing a 0.4–0.6 µm thick seed layer on 0.15–0.25 mm diameter through-hole walls. Adhesion tests per IPC-TM-650 method 2.4.8 (tape test after thermal stress) yield zero lifted pads, and backlight testing confirms no voids in the deposit. The specification governing the reliability of the finished board is IPC-6012EM for rigid printed boards used in aerospace applications, requiring a minimum copper thickness of 25 µm in the holes after pattern electroplating. The end-use application is an 18-layer polyimide hybrid rigid-flex PCB utilized in satellite communication payloads where outgassing and interconnect reliability under thermal vacuum cycling are critical.Thermal oxidative aging of polyester-based thermoplastic polyurethane (TPU) cable jackets extruded directly over bare copper conductors results in catastrophic embrittlement within 300 hr at 135 °C when no metal deactivator is present, a failure mode traced to Cu2+-catalyzed scission of the ester linkages. Incorporation of 0.08–0.20 phr 4-(4-pyridinyl)thiazole-2-thiol during twin-screw compounding (L/D 44:1, zone temperatures from 160 °C to 190 °C, screw speed 280 rpm) results in a molar excess of thiol groups that preferentially coordinate dissolved copper ions before they can participate in electron-transfer reactions with polymer hydroperoxides. The compounded granules are then processed on a 65 mm single-screw extruder with a 25 D barrel and a polyethylene crosshead, applying a 1.2 mm wall jacket over a 6.0 mm² stranded copper conductor at a line speed of 45 m/min. Retained tensile elongation after aging for 168 hr in an air-circulating oven at 150 °C remains above 85 % of the unaged value when the compound contains 0.15 phr of the additive, compared to 22 % retention for the unprotected control, as tested per IEC 60811-401. Long-term thermal endurance is assessed according to UL 1581 for a 105 °C continuous rating, and the cable construction meets the cold bend test at −40 °C and the hot pressure test at 100 °C of IEC 62893 for electric vehicle charging cables. The manufactured cable assembly is a type-approved EV charging mode 3 cable with an outer sheath color-coded per EN 50620, providing flexibility down to −35 °C and halogen-free flame retardant properties to meet IEC 60332-1-2 vertical flame propagation requirements.``` |
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| Property | 4-(4-Pyridinyl)thiazole-2-thiol | 2-Mercaptobenzothiazole | Di-n-hexyl Sulfide |
|---|---|---|---|
| Pd(II) distribution coefficient (DPd) at 0.1 M extractant, 1 M HCl | 1.2×10³ | 4.5×10² | 2.8×10² |
| βPd/Pt separation factor | 820 | 120 | 95 |
| Phase disengagement time (s) at phase ratio 1:1 | 45 | 38 | 22 |
| Crud formation tendency after 100 cycles | Moderate (disulfide accumulation) | Low | Negligible |
| Stripping efficiency with 1 M thiourea | 99.2% | 97.5% | 88.0% |
| Parameter | Method | Limit |
|---|---|---|
| Assay (HPLC, anhydrous basis) | In-house validated, C18 column, gradient MeCN/water 0.1% TFA | 98.5–101.0% |
| Water content | Karl Fischer, ISO 760 | ≤0.3% |
| Residue on ignition | Ph. Eur. 2.4.14 | ≤0.1% |
| Heavy metals (as Pb) | Ph. Eur. 2.4.8, Method C | ≤10 ppm |
| Palladium | ICP-MS after microwave digestion | ≤5 ppm |
| Related substances (single impurity) | HPLC, relative retention time range 0.5–2.0 | ≤0.5% |
| Total impurities | HPLC | ≤1.5% |