|
HS Code |
174944 |
| Chemical Formula | C10H13NO2 |
| Molecular Weight | 179.216 g/mol |
| Appearance | Solid |
| Solubility In Water | Low solubility |
| Solubility In Organic Solvents | Soluble in common organic solvents |
| Stability | Stable under normal conditions |
As an accredited 1-Cyclohexyl-1H-Pyrrole-2,5-Dione factory, we enforce strict quality protocols—every batch undergoes rigorous testing to ensure consistent efficacy and safety standards.
| Packing | 100g of 1 - Cyclohexyl - 1H - Pyrrole - 2,5 - Dione packaged in a sealed plastic bottle. |
| Shipping | 1 - Cyclohexyl - 1H - Pyrrole - 2,5 - Dione is shipped in properly sealed containers, following strict chemical transport regulations. Packaged to prevent spills and damage, transported via approved carriers ensuring safe and timely delivery. |
| Storage | 1 - Cyclohexyl - 1H - pyrrole - 2,5 - dione should be stored in a cool, dry place. Keep it away from heat sources, open flames, and direct sunlight to prevent decomposition. Store in a tightly - sealed container to avoid contact with air and moisture, which could potentially react with the chemical. Also, ensure it is segregated from incompatible substances. |
In the continuous mass polymerization of acrylonitrile-butadiene-styrene (ABS), substitution of a styrene fraction with 1-cyclohexyl-1H-pyrrole-2,5-dione (CHMI) at a monomer-stage addition level of 6–15 wt% of the total feedstock raises the glass transition temperature (Tg) of the styrene-acrylonitrile (SAN) matrix phase from 105 °C to a range of 118–128 °C (DSC, 10 K/min, second heat per ISO 11357-2:2020). The downstream process involving a 40 L/D co-rotating twin-screw extruder configured with a multi-stage devolatilization zone (–0.095 MPa vacuum, 260–275 °C melt temperature) strips residual cyclohexylmaleimide monomer to below 800 ppm, a threshold set by automotive interior VOC specifications. The rigid cyclic imide pendant group retards chain mobility without imparting the yellow tint observed with phenylmaleimide analogues; this maintains base colour coordinates of granulate within ΔE < 1.2 (CIE L*a*b* D65/10°). Formulated grades are employed in Class-B instrument panel carriers, centre console substructures, and A-pillar trim where heat sag resistance under 120 °C glass-sunload conditions is non-negotiable. Compliance rests on REACH registration of the monomeric substance and conformance to VDA 278:2011 for volatile emissions; if the finished article is destined for interior trim with incidental skin contact, migration of the monomer must fall within the specific migration limit framework of EU 10/2011 at the verification stage, though CHMI itself is not listed as a dual-use additive and its detection limit of 10 µg/dm² commonly serves as a surrogate pass criterion.What Drives the Optical Clarity Shift in Methyl Methacrylate–CHMI Copolymers?The reactivity ratio sequence rMMA ≈ 0.8–1.1 and rCHMI ≈ 0.3–0.5 in free-radical solution polymerization (toluene/MEK, 80 °C, AIBN initiator 0.3 mol%) produces a gradient copolymer architecture rather than a strictly alternating sequence, causing an incremental drop in percent transmittance once the CHMI feed fraction exceeds 18 mol% because microphase-separated domains with an electron-deficient imide aggregation appear at the 50–150 nm scale detectable by small-angle X-ray scattering. To retain > 89 % light transmission (3 mm thickness, ASTM D1003-21) while elevating the Vicat softening point from 102 °C to 131 °C (ISO 306:2022, Method B50), a semicontinuous monomer-starved dosage strategy is implemented: CHMI dissolved in MMA is fed over 4–6 h into a pre-polymerized seed latex (particle size 220 nm) using a redox couple—typically tert-butyl hydroperoxide/sodium formaldehyde sulfoxylate—maintained at 65 °C. Post-reaction steam stripping under 3 kPa absolute pressure yields bead copolymer with a residual volatile fraction under 450 ppm. The resulting moulding powder is calendered and milled into optical-grade sheet for automotive LED light-pipe covers requiring > 85 % luminous transmittance after 2,000 h xenon-arc weathering (ISO 4892-2:2013, cycle A). Regulatory adherence is dual-track: the copolymer is amenable to FDA 21 CFR § 177.1010 (acrylic polymers in food contact) provided extractable cyclohexylmaleimide monomer remains below the 50 ppb threshold quantified by HPLC-UV; simultaneously, electronic-grade batches must meet ion chromatography limits of ≤ 5 ppm chloride and ≤ 1 ppm sodium to satisfy photolithography substrate purity conventions. A distinct manufacturing sequence emerges when CHMI serves as a co-agent in peroxide-cured ethylene-propylene-diene terpolymer (EPDM) dense profiles. The imide functionality participates in a thermally triggered ene-addition across the pendant ethylidene norbornene unsaturation, bridging chains without the formation of polysulfidic links that deteriorate compression set after prolonged air aging at 150 °C. A typical interior mixing protocol (tangential internal mixer, ram pressure 0.6 MPa, dump temperature 120–125 °C) incorporates 1.5–3.0 phr CHMI together with a dialkyl peroxide (dicumyl peroxide at 2.0 phr) and a hydrotalcite acid scavenger. Cure rheometry (ASTM D5289-19a, moving-die rheometer, 180 °C arc 0.5°) registers a torque delta (MH – ML) enhancement of 17–22 dN·m compared with the sulfur-donor control, confirming a crosslink density structurally distinct from conventional vulcanizates. Extrusion of the formulated compound through a pin-barrel extruder (L/D 14:1, head pressure 12–16 MPa) yields closed-cell sponge and solid primary door seals tested against VW TL 52041 for static stiffness change under compression after 504 h at 100 °C. Because the co-agent itself is nitrogen-bearing, the National Fire Protection Association (NFPA 652) combustible dust hazard classification must be considered in powder handling, and local exhaust ventilation maintaining a minimum capture velocity of 0.5 m/s at the weigh-station is prescribed to keep airborne exposure below the manufacturer’s recommended 5 mg/m³ (respirable fraction). Accelerator-Free Cure Systems in EPDM Extrusion ProfilesWhere the elimination of zinc-containing accelerators is mandatory under the EU Ecolabel for rubber surfacing (Commission Decision 2014/69/EU), 1-cyclohexyl-1H-pyrrole-2,5-dione at 2.5 phr delivers a state of cure equivalent to a zinc oxide/tetramethylthiuram disulfide package while holding heavy-metal residue below the 5 ppm limit. Formulations discharged from an intermeshing reverse-rotation twin-screw continuous mixer are shaped through a gear pump to a flat die and microwave-heated (2,450 MHz, 4–6 kW power input) followed by a hot-air tunnel at 210–230 °C, achieving full cure in a 24 m line in under 1.5 min. Shore A hardness (ISO 48-4:2018) remains within ±3 points of the sulfur-cured reference, while the retention of elongation at break after immersion in IRM 903 oil for 70 h at 125 °C is > 72 %, confirming the imide crosslinks are resistant to basic hydrolysis conditions. Processing of rigid poly(vinyl chloride) profiles for high-Tg window frames exploits the radical-scavenging potential of the maleimide ring: CHMI is introduced not as a neat monomer but as a pre-formed imidized copolymer (CHMI-α-methylstyrene-acrylonitrile, typical composition 55/25/20 wt%) blended into a PVC dry blend at a loading of 12–18 phr. Fusion in a counter-rotating conical twin-screw extruder (screw diameter 54/110 mm, metering zone temp 185 °C) yields a heterogeneous morphology where the heat-distortion temperature (ISO 75-2:2013, Method Bf) climbs from 72 °C to 93 °C without the embrittlement typical of chlorinated PVC compositions. Ultrasonic weld-line integrity of the finished sash corner, tested according to ASTM F2157-09, shows a breaking torque exceeding 38 N·m because the molecular rigidity of the imide-rich dispersed phase suppresses chain slippage at the fusion interface. A factory-level durability campaign referencing EN 12608-1:2021 for unplasticised PVC profiles requires an additional window of rapid colorimetric change: the additive copolymer must not lift the yellow index by more than 2 units over 1,200 h in a QUV-B test (ASTM G154, Cycle 1). Synthesis of heat-resistant solvent-borne alkyd coatings that cure at ambient temperature is recast when 1-cyclohexyl-1H-pyrrole-2,5-dione is incorporated as a chain-extension monomer during the polyesterification stage. A typical alkyd backbone (soya fatty acid, trimethylolpropane, isophthalic acid) is cooked to an acid value below 12 mg KOH/g before the molten CHMI is charged at 3.5–6.0 wt% of total solids at 160–170 °C and held for 45 min to complete the Diels-Alder addition across conjugated linoleic unsaturation. After thinning to 55 wt% non-volatile content with a high-flash naphtha, the varnish cures to a König pendulum hardness (ISO 1522:2007) of 56 s versus 28 s for the unmodified batch after 7 days at 23 °C, 50 % RH. The coating’s methyl ethyl ketone double-rub resistance (ASTM D5402-19) registers > 180 cycles, translating into effective blocking resistance for steel shelving systems assembled without interleaving tissue. Volatile organic compound content remains compliant with the Directive 2004/42/CE industrial maintenance coating subcategory limit of 500 g/L.
Notes: Vicat measured per ISO 306:2022 Method B50; impact per ISO 179-1:2023/1eA; transmittance per ASTM D1003-21. Values represent compression-moulded plaques conditioned at 23 °C, 50 % RH for 96 h. Photocurable Patterning Resists and Dielectric FilmsSpin-coated negative-tone photoresists formulated with a CHMI-containing acrylate oligomer (Mn = 2,400 g/mol, dispersity 1.25) and a multi-functional thiol crosslinker achieve a resolution of 3 µm line/space under 365 nm i-line exposure (120 mJ/cm²) through the thiol–ene click mechanism facilitated by the electron-deficient imide ring that accelerates radical propagation. The cured film exhibits a dielectric constant of 2.78 at 10 GHz (split-post dielectric resonator, IEC 62810:2015) and a breakdown strength exceeding 380 V/µm (ASTM D149-20, DC ramp), making it suitable for redistribution layers in fan-out wafer-level packages. Outgassing during thermal cycling (30 min at 250 °C) stays under 0.9 wt% when measured by thermogravimetric analysis coupled with mass spectrometry, a pre-qualification requirement aligned with the NASA-RP-1124 outgassing standard. In unsaturated polyester resin (UPR) bulk moulding compounds for high-temperature appliance housing, the coreactant ratio in the alkenyl monomer phase is shifted from styrene-only to a styrene–CHMI blend (75:25 by volume). Low-profile additive efficiency is maintained because the cyclohexyl group introduces sufficient segmental motion to avoid microfissuring during the exotherm spike that peaks at 192 °C in a 50 mm thick section. The dough-like compound, processed on a Z-blade mixer at 38 °C, is compression-moulded into endplates for oven cavities; the part withstands a static load of 1.8 MPa at 180 °C for 168 h with less than 1.2 mm deflection (ISO 75-1:2020 Procedure C). During initial factory scale-up, batch-to-batch variation in gel time occasionally fell outside the 22 ± 3 min window (82 °C SPI gel test) when recycled styrene streams containing residual inhibitor exceeded 25 ppm of 4-tert-butylcatechol—a practical limit documented in production logs rather than supplier safety data sheets, underscoring the sensitivity of the redox cure profile to inhibitor carryover. When coated aluminium food trays require an adhered heat-seal lacquer functional at 230 °C (conventional oven reheat), a terpolymer of CHMI, butyl acrylate, and glycidyl methacrylate at a weight ratio 32/55/13 is dissolved in propylene glycol monomethyl ether acetate to a viscosity of 68 s (DIN 4 mm cup) and roller-coated to a dry film thickness of 6 µm. Crosslinking through the oxirane groups is triggered during the 0.5 s dwell time under an infrared emitter bank operating at a medium-wave 3.2 µm peak wavelength, raising the maximum seal strength to 22 N/15 mm (ASTM F904-16, velocity 200 mm/min) without pre-lamination. The cyclohexylimide component suppresses creep at the sealing jaw temperature of 190 °C so that the peel curve remains cohesive after a 30 min thermal soak. Compliance with Regulation (EC) No 1935/2004 is supported via a declaration that overall migration into food simulant D2 (vegetable oil) at 175 °C for 2 h is < 8 mg/dm², with specific migration of the imide monomer confirmed below the analytical detection limit. |
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| Property | N-Cyclohexylmaleimide | N-Phenylmaleimide | N-Methylmaleimide | Test Method |
|---|---|---|---|---|
| Molecular weight (g·mol⁻¹) | 179.22 | 173.17 | 111.10 | — |
| Melting point (°C) | 89–91 | 88–90 | 96–98 | ASTM E324 |
| Boiling point (°C) at 10 mmHg | 132–135 | 162–165 | 96–98 (at 25 mmHg) | — |
| Saturated vapour pressure at 25 °C (Pa) | <0.01 | <0.005 | ~0.12 | Calculated EPI Suite |
| Tg shift in BADGE/anhydride system (10 phr loading) (°C) | +8 to +12 | +3 to +5 | Not reported | ASTM D7028 |
| Solubility in styrene at 25 °C (g/100 g) | 35 | 28 | Miscible | Gravimetric |
| Typical commercial purity (%) | ≥98.5 | ≥99.0 | ≥99.0 | GC, area % |