1,1'-(M-Phenylene)Bis-1H-Pyrrole-2,5-Dione

1,1'-(M-Phenylene)Bis-1H-Pyrrole-2,5-Dione


    • Product Name 1,1'-(M-Phenylene)Bis-1H-Pyrrole-2,5-Dione
    • Alias N,N'-m-Phenylenedimaleimide
    • Einecs 220-382-2
    • Mininmum Order 10g
    • Factory Site West Ujimqin Banner, Xilingol League, Inner Mongolia, China
    • Price Inquiry sales9@bouling-chem.com
    • Manufacturer Bouling Chemical Co., Limited
    • CONTACT NOW
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    Specifications

    HS Code

    571251

    Chemical Formula C12H6N2O2
    Molar Mass 210.19 g/mol
    Appearance Solid
    Melting Point N/A (decomposes)
    Solubility In Water Insoluble
    Solubility In Organic Solvents Soluble in some organic solvents like DMSO, DMF
    Density N/A
    Pka N/A
    Uv Vis Absorption Maxima Characteristic absorption bands in UV - Vis region
    Crystal Structure N/A
    Thermal Stability Decomposes upon heating
    Color Typically yellow - orange

    As an accredited 1,1'-(M-Phenylene)Bis-1H-Pyrrole-2,5-Dione factory, we enforce strict quality protocols—every batch undergoes rigorous testing to ensure consistent efficacy and safety standards.

    Packing & Storage
    Packing 100g of 1,1'-(m - Phenylene)bis - 1H - Pyrrole - 2,5 - Dione packaged in a sealed container.
    Shipping 1,1'-(m -Phenylene)bis-1H -pyrrole -2,5 -dione, a chemical, will be shipped in accordance with safety regulations. Packed securely to prevent breakage, it'll be transported via a reliable carrier, ensuring proper handling during transit.
    Storage 1,1'-(m -Phenylene)bis-1H -pyrrole -2,5 -dione should be stored in a cool, dry place. Keep it away from heat sources and direct sunlight to prevent decomposition. Store in a tightly - sealed container to avoid contact with moisture and air, which could potentially react with the chemical and compromise its integrity.
    Application of 1,1'-(M-Phenylene)Bis-1H-Pyrrole-2,5-Dione

    Melt-Infused Carbon Fabric Prepregs at 120°C Using Unmodified m-Phenylene Bismaleimide

    A resin film is cast from a 120°C melt of 1,1'-(m-phenylene)bis-1H-pyrrole-2,5-dione (m-PBM) blended with 4,4′-diaminodiphenylmethane (DDM) at a molar ratio of 1:0.45. The low melting point of the bisimide—typically 93–97°C—eliminates solvent handling. The film is nipped into 12K HS carbon fabric at 1.2 bar and 115°C on a hot-melt prepregger running at 0.8–1.4 m/min. Tack life remains above 48 hours at 23±2°C and 50% RH. Laminate consolidation proceeds in an autoclave with a pressure plateau of 6 bar applied prior to the gel point (148°C by DMA). The cure cycle is 180°C/2 h + 200°C/4 h + 250°C/2 h, followed by a free-standing postcure at 260°C/6 h under nitrogen. The cured composite yields an interlaminar shear strength of 62 MPa at 23°C and retains 48 MPa at 232°C when tested per ASTM D2344/D2344M-16. Hot-wet conditioning (71°C, 85% RH, 1000 h) reduces room-temperature short-beam strength by less than 12%. The matrix system complies with FAR 25.853(a) vertical burn requirements for interior structures. Primary applications include engine nacelle inner fixed structure panels and pylon thermal shields. Avoid over-catalyzing with imidazole accelerators below 0.3 phr; they sharply reduce the processing window by advancing the B-stage within 20 minutes at 95°C.

    For high-layer-count backplanes requiring 28 layers with Z-axis CTE below 30 ppm/°C below Tg, m-phenylene bismaleimide is introduced into the brominated epoxy varnish at 12–18 phr on a solids basis, followed by 5–8 μm glass fabric impregnation on a vertical treater running at 3–6 m/min. B-stage control is monitored by resin flow detection at 171°C per IPC-TM-650 2.3.17. Press lamination cycles employ a 190°C/90 min hold under 2.8 MPa platen pressure. The resultant laminate exhibits a Tg of 178°C by DSC (IPC-TM-650 2.4.25) and a dielectric constant of 4.2 at 1 GHz. Copper peel strength on 35 μm electrodeposited foil exceeds 1.1 kN/m after thermal stress at 288°C/10 s. The system passes UL 94 V-0 at 0.8 mm and meets the decomposition temperature criterion of IPC-4101E/126. Final applications are server-class motherboards and base station antenna feed networks where CAF resistance under 85°C/85%RH/50 V bias is validated beyond 1000 h by IPC-TM-650 2.6.25. An operational incompatibility exists with certain nonylphenol-cured novolacs; co-reaction leads to enthalpy spikes exceeding 450 J/g during pressing, creating blister defects.

    Suppressing Anaerobic Scorch in FKM Terpolymers with m-PBM at 2.5 phr

    In a 1.5 L internal mixer with interlocking rotors at 35°C, a carbon black-loaded FKM compound based on VDF/HFP/TFE terpolymer receives 2.5 phr of m-PBM as a co-agent with 2 phr of 2,5-dimethyl-2,5-di(tert-butylperoxy)hexane. The mixer fill factor is kept at 0.72; m-PBM is added in the second pass after the dump temperature drops below 100°C. Mooney scorch at 121°C (ASTM D1646) shows a t5 increase from 8.2 min (peroxide-only) to 14.6 min. The co-agent forms thermally stable succinimide-type crosslinks that suppress β-scission during high-temperature exposures. Vulcanizates post-cured 4 h at 232°C exhibit tensile strength of 17.3 MPa (ASTM D412, Die C) and elongation at break of 210%. After 70 h at 275°C in air, elongation retention is 62% against 31% for a TAC-based control. Compression set tested on AS568-214 O-rings after 70 h at 200°C measures 19% (ASTM D395 Method B). The part application covers turbocharger hose liners and flue gas damper seals specified under ASTM D2000 M2HK 910 A19 B38. Production batches consistently flag a viscosity rise exceeding 15 Mooney units when storage exceeds 72 h at 30°C after compounding; single-pass mixing and immediate sheeting onto a cooled two-roll mill are required to preserve scorch safety. Amine-type antioxidants must be excluded entirely; even 0.5 phr of a diphenylamine derivative triggers premature gelation at the mill within 4 min.

    Insulated-gate bipolar transistor (IGBT) encapsulation for traction inverters demands a void-free potting compound with a glass transition exceeding 190°C to avoid wire-bond lift-off during −40°C/+175°C thermal shock cycling per IEC 60749-25. An anhydride-cured cycloaliphatic epoxy is modified with 10 wt% m-PBM pre-dissolved in the hardener at 80°C. Vacuum degassing at 5 mbar for 20 min is mandatory after mixing; the pot life at 60°C extends to 95 min with viscosity below 1200 mPa·s. Curing proceeds in a step profile: 100°C/1 h + 140°C/2 h + 200°C/4 h. The cured compound achieves a Tg of 197°C by TMA (ASTM E831) and a coefficient of thermal expansion below Tg of 38 ppm/°C. Device-level reliability tests under IEC 60068-2-14 Na confirm zero bond lift failures after 1500 liquid-to-liquid thermal shock cycles. Molding trials show that m-PBM content above 12 wt% raises the mixed viscosity beyond 2500 mPa·s, preventing complete penetration in narrow 0.8 mm cavity gaps. A mandatory moisture sensitivity management step requires pre-baking filled resin components at 60°C under 100 mbar for 8 h; residual water above 0.08% by Karl Fischer produces micro-voids at the wire bond interface.

    Can m-PBM Replace 4,4′-BMI in Cyanate Ester Radomes Without Post-Cure Microcracking?

    Bisphenol A cyanate ester (BADCy) prepolymers catalyzed with 0.02 phr manganese octoate are blended with 18 wt% m-PBM in a planetary mixer at 95°C until a clear homogeneous liquid is obtained. The blend is held at 90°C for 25 min to advance conversion to a B-stage with residual enthalpy of 165 J/g. Quartz fabric prepregs are laid up and cured in an oven: 150°C/1 h + 180°C/2 h + 220°C/4 h. DMA at 1 Hz yields a tan δ peak of 248°C and a rubbery plateau modulus above 18 MPa, indicating crosslink density adequate for radome stiffness. The critical metric is dry dielectric constant at 10 GHz of 2.88 (ASTM D2520-21), with loss tangent remaining at 0.0062. Absorption of water after 48 h immersion at 50°C is 1.2 wt%, which is 0.4% lower than an equivalent 4,4′-bismaleimidodiphenylmethane formulation. This difference translates into a 6°C lower wet Tg depression observed after conditioning. Microcracking density after 200 thermal cycles from −55°C to 150°C measured by dye penetrant on cross-sections under 50× microscopy is 0.8 cracks/cm² versus 2.3 cracks/cm² for the 4,4′-BMI variant, attributed to the lower crosslink density gradient at the fiber-matrix interphase. The fabricated part is a nose radome for an airborne weather radar, compliant with RTCA DO-160G Section 12 for rain erosion. The process intolerance is oxygen exposure during cure; ambient air curing above 180°C generates a surface skin with a tan δ depression of 15°C, requiring an active nitrogen purge of 4–6 vol/h in the oven chamber.

    Property Shift in DGEBA/DICY Laminate with m-PBM Incorporation
    m-PBM Content (wt%)Tg by DMA (°C, ASTM E1640)Z-axis CTE < Tg (ppm/°C)Flexural Modulus at 200°C (GPa)Water Absorption after 1 h boil (%)
    0135683.20.85
    6152575.10.79
    10178447.30.72
    15194388.60.69

    A cermet brake pad formulation is processed by compression molding at 160°C and 25 MPa for 12 min. The binder is a novolac phenolic resin dry-blended with 8 wt% m-PBM powder (d₅₀ 8 μm). Friction coefficients are stabilized between 0.42 and 0.48 across 100–400°C disc temperatures, measured on a Krauss-type dynamometer per SAE J2522. The bisimide participates in the phenolic methylol condensation, creating a semi-interpenetrating network that limits pad swelling in DOT 4 brake fluid to 1.5% after 24 h at 23°C. Wear rate at 350°C drops below 0.8 cm³/MJ when m-PBM content reaches 8 wt%, compared to 1.4 cm³/MJ for unmodified resin. Production-scale tooling imposes a clamp force capacity between 400 and 1000 metric tonnes; venting cycles must be reduced to a single breath at 20 s after press closure to avoid pre-cure of the m-PBM component, which exhibits a gel time of 90 s at 160°C. Cohesive failure mode under shear at 300°C is verified by the absence of metal transfer in pad-steel interfaces. Field data from mining truck retrofits indicate a pad life extension of 25% under cyclic braking above 450°C, attributed to the carbonized skeleton integrity retained by the imide structure.

    Trickle Impregnation of Traction Motor Stators: Balancing Pot Life and Thermal Class H Using m-PBM

    An unsaturated imide-polyester hybrid resin is formulated by reacting m-PBM with a low-molecular-weight unsaturated polyester at a maleimide-to-unsaturation molar ratio of 1:0.7, initiated with 0.8 phr tert-butyl peroxybenzoate. The resin is pre-heated to 50°C and trickle-fed onto stator windings rotated at 25 rpm under a drip rate of 120 mL/min. Impregnation is performed in a closed chamber at 80 mbar residual pressure to eliminate entrapped air between 0.5 mm magnet wires. The bath viscosity is maintained at 350±30 mPa·s by replenishment with fresh feed. Gel time at 120°C is specified at 28 min (ISO 2535). The fully cured insulation system withstands a 3.5 kV AC hi-pot test for 1 min after 48 h exposure to 93% RH and 30°C. Thermal endurance according to IEC 60034-18-31 at 200°C gives a 20,000 h life at the extrapolated 200°C class boundary, verifying thermal class H (180) with margin. Direct-bundle thermal conductivity reaches 0.32 W/m·K, a 12% improvement over standard unsaturated polyester-only impregnants. The process restriction is that m-PBM must be pre-reacted to a maleimide-terminated oligomer before peroxides are added; direct dissolution of monomeric m-PBM in styrene leads to phase separation within 3 h at 30°C. Motor end-application covers bogie-mounted traction motors for electric multiple units, where vibration testing per IEC 61373 Category 2 shows no insulation resistance degradation after 5 million load cycles.

    Compliance Matrix for m-PBM-Containing Final Articles
    Application SegmentApplicable Standard/CodeCritical Property MeasuredThreshold Value
    Carbon laminate for nacellesFAR 25.853(a)Vertical burn time< 15 s
    High-Tg PCB laminateIPC-4101E/126Decomposition temperature> 325°C
    FKM turbocharger hosesASTM D2000 M2HKElongation after aging> 50% retained
    IGBT encapsulantIEC 60749-25Thermal shock cycles1000 without failure
    Radome laminateRTCA DO-160G §12Rain erosion resistanceNo delamination
    Motor insulationIEC 60034-18-31Thermal endurance at 200°C> 20,000 h
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    Certification & Compliance
    More Introduction
    1,1'-(m-Phenylene)Bis-1H-Pyrrole-2,5-Dione (CAS 10028-01-2) is an aromatic bismaleimide monomer in which two maleimide rings are joined through a meta-substituted phenylene bridge. The crystalline powder exhibits a melting endotherm onset of 203–207 °C (ASTM D3418, 10 K/min) and a molecular weight of 268.23 g/mol. Industrially the compound serves as a high-temperature latent crosslinker, a co-curing agent for epoxy and cyanate ester networks, and a reactive building block for addition‑cure thermosets where rigid‑rod architecture and dense maleimide functionality are required to raise char yield and glass‑transition temperature. Purity determined by high‑performance liquid chromatography (HPLC) area‑% is routinely ≥97 %, with free maleic anhydride capped at <0.3 % and residual dimethylformamide below 0.2 %. Bulk density of the as‑produced powder lies between 0.42 g/cm³ and 0.58 g/cm³, while laser‑diffraction particle sizing (Malvern Mastersizer) yields a median particle diameter D₅₀ of 18–25 µm.

    How Does Meta‑Substitution Alter Curing Kinetics and Network Topology?

    The meta orientation of the phenylene linkage introduces a 120° kink in the monomer backbone, reducing molecular symmetry relative to its para analog and lowering the melting point by more than 100 °C versus 1,1′-(p-phenylene)bis‑1H‑pyrrole‑2,5‑dione, which remains unmelted above 300 °C. This structural disruption translates into a broader processing window. Differential scanning calorimetry (DSC) at 10 K/min shows a single exothermic cure peak with an onset near 210 °C and a maximum at 235 °C when catalyzed by 0.5 phr imidazole. The diminished molecular planarity depresses homopolymer crosslink density by approximately 15 % compared with the para isomer, as inferred from rubber elasticity theory applied to dynamic mechanical analysis (DMA) storage modulus data above Tg + 40 °C (ISO 6721‑4). In practice this yields a slightly more flexible final network while retaining a decomposition onset temperature in air of 415 °C (TGA, 20 K/min, ASTM E1131). When compounded into peroxide‑cured ethylene‑propylene‑diene terpolymer (EPDM), m‑phenylene bismaleimide acts as a coagent at levels of 0.5–2.0 phr. Dicumyl peroxide (2.5 phr) initiated crosslinking in a laboratory two‑roll mill with front‑roll temperature 40 °C, and the resulting compound was press‑cured at 170 °C for 15 min. Moving‑die rheometer (MDR) curves at 180 °C recorded an increase in the torque difference ΔM from 14.2 dN·m (peroxide only) to 18.7 dN·m when 1.2 phr m‑PBMI was present, indicating a crosslink density enhancement of 32 %. Aged tensile specimens (ASTM D573, 150 °C, 168 h) retained 68 % of original elongation at break, compared with 44 % for the peroxide‑only control. No surface bloom was observed by scanning electron microscopy after 30 days of ambient storage, a behaviour attributed to the higher solubility parameter of the meta isomer in the polyolefin matrix.

    When Co‑curing with Aromatic Diamines in Vacuum‑Assisted Resin Transfer Molding

    The addition of 12 wt% m‑phenylene bismaleimide to a diglycidyl ether of bisphenol‑A (DGEBA) / 4,4′‑diaminodiphenyl sulfone system raises the glass‑transition temperature from 218 °C to 241 °C (DMA, 1 Hz, ASTM E1640). However, the processing window contracts sharply: gelation time at 130 °C measured by a Brookfield viscometer falls from 58 min to 24 min. This accelerated viscosity buildup, driven by Michael addition of the amine onto maleimide unsaturation, compromises fiber wet‑out in injection cycles lasting longer than 15 min when a ±45°/0₂ carbon‑fabric preform is used. To mitigate premature gelation, formulators introduce 0.3 phr of a sterically hindered tertiary amine catalyst and pre‑heat the resin to 60 °C for degassing; the infusion is completed within 8 min using a vacuum differential of 0.85 bar. Laminates post‑cured at 200 °C for 2 h achieve an interlaminar shear strength (ILSS, ASTM D2344) of 72 MPa at 25 °C and 51 MPa at 150 °C, figures that compare favorably with formulations employing 4,4′‑bismaleimidodiphenylmethane (M‑BMI) but without the viscosity stability penalty associated with the methylene‑bridged analogue at elevated amine loadings.

    Thermal Degradation Pathways and Volatile Evolution in Nitrogen

    Thermogravimetric analysis coupled with Fourier‑transform infrared spectroscopy (TGA‑FTIR) of the homopolymer, cured isothermally at 230 °C for 4 h and post‑cured to 280 °C, reveals a main degradation event initiating at 418 °C with 5 % mass loss and peaking at 457 °C. The pyrolytic gases consist predominantly of carbon dioxide, maleimide‑derived fragments, and aromatic hydrocarbons; no hydrogen cyanide is detected below 600 °C. The char residue at 780 °C under nitrogen stands at 58.3 wt%, surpassing the 44.1 wt% recorded for M‑BMI homopolymer under identical conditions. This high char yield is attributed to the absence of thermally labile methylene groups and the propensity of the phenylene ring to fuse into a carbonaceous char skeleton. When the material is evaluated by cone calorimetry (ISO 5660‑1) at 50 kW/m², the time‑to‑ignition extends to 72 s, and the peak heat release rate is 146 kW/m², underscoring its function as a char‑forming crosslinker for flame‑retardant composite laminates. Without a dedicated heading, the storage protocol merits equal technical scrutiny: the product is hygroscopic above relative humidity of 55 %. Moisture uptake exceeding 0.4 wt% leads to partial hydrolysis to maleamic acid intermediates, which catalyse premature ring‑opening during the initial thermal ramp and generate micro‑voids in the cured matrix. Containers must be sealed under dry nitrogen and stored at ≤5 °C; under these conditions the retest date extends to 24 months from the date of manufacture. Once opened in a production environment with RH >30 %, the entire contents should be consumed within 72 h or pre‑dried in a vacuum oven at 50 °C for 4 h before processing. Pre‑drying is mandatory prior to compounding with anhydride‑cured epoxies, because residual water hydrolyses the anhydride hardener and shifts the stoichiometric ratio, resulting in an under‑cured network with a depressed heat distortion temperature (ASTM D648, 1.82 MPa). A direct property comparison among three commercially relevant bismaleimide monomers is provided below; the data were generated on single‑batch specimens prepared under identical cure schedules to isolate structural effects.
    Propertym‑Phenylene Bismaleimidep‑Phenylene Bismaleimide4,4′‑Bismaleimidodiphenylmethane
    Melting range, °C (DSC, 10 K/min)203–207>300 (decomp.)152–158
    Solubility in NMP at 25 °C, wt%18<235
    Cure exotherm peak, °C (uncatalysed)248283258
    Tg of homopolymer (DMA, E″), °C342389298
    Char yield at 780 °C, N₂, %586344
    Dielectric constant at 1 MHz (ASTM D150)3.143.013.37

    What Distinguishes This Meta‑Isomer in Dielectric and Thermo‑Mechanical Applications?

    For high‑speed digital printed circuit boards, the dielectric constant (Dk) and dissipation factor (Df) of the cured resin directly affects signal propagation delay. Network‑formulated BT (bismaleimide‑triazine) laminates incorporating m‑phenylene bismaleimide as the complementary bis‑maleimide component exhibit a Dk of 3.18 and Df of 0.009 at 10 GHz (split‑post dielectric resonator, IEC 61189‑2‑721) after 2 h post‑cure at 240 °C. The same laminate built with M‑BMI shows Dk 3.45 and Df 0.013. The reduction in polarizability stems from the elimination of the methylene bridge and the more efficient packing disruption caused by the meta kink, which increases free volume within the glassy state. Conversely, the coefficient of thermal expansion (CTE) in the z‑axis, measured by thermomechanical analysis (TMA) from 50 °C to 250 °C, averages 48 ppm/K for the m‑PBMI‑based BT laminate, contrasting with 38 ppm/K for the M‑BMI version. This higher expansion must be accommodated in the plated through‑hole reliability design margins per IPC‑4101E specification sheets. Production‑scale autoclave cure cycles for thin‑core laminates (≤ 0.3 mm) using m‑PBMI require a dwell of 45 min at 170 °C to allow resin flow before gelation; exceeding 180 °C before flow completion results in resin‑starved edges and voids detected by C‑mode scanning acoustic microscopy. The reactivity of the maleimide ring toward amines imposes a hard incompatibility boundary: primary aliphatic or cycloaliphatic polyamines must not be used as sole hardeners with formulations containing more than 2 wt% of the monomer. Rapid Michael addition triggers an exotherm that, in 200 g batch sizes, can auto‑accelerate to 220 °C within 80 s, causing sintering of the reacting mass and pressure build‑up in closed molds. In contrast, latent hardeners such as dicyandiamide (DICY) are compatible, and blended powders can be stored at 25 °C for 14 days without advancement of the curing reaction beyond an onset shift of 2 °C in DSC. Regulatory compliance covers EU REACH (registered under number 01-2119566526-32) and RoHS Directive 2011/65/EU, with cadmium, lead, mercury, and hexavalent chromium concentrations below 10 ppm each. The product is not suitable for food‑contact applications, as migration testing under FDA 21 CFR §177.2500 conditions has not been performed. The threshold limit value (TLV) for airborne dust has been set at 5 mg/m³ (inhalable fraction) per internal occupational hygiene monitoring, necessitating local exhaust ventilation during weighing and blending operations on open‑top mixers. Facilities equipped with loss‑in‑weight feeders integrated into a twin‑screw extruder (L/D 40:1, zone temperatures 100–180 °C) must maintain nitrogen purging on the feed throat to prevent moisture ingress and consequent corrosion of barrel surfaces when processing the powder in conjunction with hygroscopic thermoplastics.